|
D&R portal is the unique and most comprehensive worldwide resource portal
for IPs and SOC design, and Foundries play a key role in the IP based SoC design chain.
"Silicon proven" label is the star label differentiating highly valued IPs
in this marketplace. Thus D&R is glad to open this Foundry corner where the specific process for which Silicon
IPs have been hardened is emphasized. This gives to the IP provider an
unique opportunity to show the value of their IPs, to the OEMs acquiring
the IPs a "quality proof " and to the Foundries the visibility they deserve.
In this foundry corner you can have access:
| |
Latest News:
|
TSMC April 2008 Sales Report (May. 09, 2008) |
|
Intel, Samsung Electronics and TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (May. 06, 2008) |
|
SMIC and Amlogic in Commercial Production of 90nm Digital Photo Frame Chip (Apr. 24, 2008) |
|
TSMC Unveils New 40/65-Nanometer SPICE Tool Qualification Program (Apr. 22, 2008) |
|
Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer (Apr. 22, 2008) |
|
SMIC and ASTRI Collaborate on the Development of the World's First Dual Mode UWB MAC ASIC Supporting Both WiMedia Compliant WLP and China IGRS Networking Applications (Apr. 21, 2008) |
|
TSMC Announces Power Trim Service for Advanced Chip Leakage Power Reduction (Apr. 15, 2008) |
|
TSMC March 2008 Sales Report (Apr. 10, 2008) |
|
New X-FAB 0.18 Micrometer Process Maximizes Cost-Effectiveness in Analog/Mixed-Signal Chip Design for Commercial Automotive and Power Management Applications (Apr. 08, 2008) |
|
Chartered Extends Technology Development Collaboration with IBM to 22-Nanometer Process Node (Apr. 02, 2008) |
|
|
