Low-power digital applications are the next target as SOI CMOS is
becoming a mainstream technology and power dissipation is the main
concern.
SOI CMOS technologies are the most suitable technologies to produce RF
Systems on Chip, combining the low-power advantage for the digital part
and the high RF performance enabled by the full dielectric isolation of
the SOI substrate and the ability to use a high-resistivity substrate
(minimizing crosstalk and substrate losses).
