D&R Headline News (Last 14 Days)
Headlines for Thursday May. 09, 2024
X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
The Open-Standard C-GPU solutions, offered as IP blocks and software, enable leading processor companies to develop low-power SoCs for Next Generation 3D Graphics, Compute, and AI/ML enabled wearables, AR/VR headsets, auto displays, edge and cloud processing, industrial systems, robotics, and other connected embedded/IoT devices.- Arm revenues up 47%; shares fall
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
- Softbank reported to be in talks to buy Graphcore
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
- SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring
- Ceva, Inc. Announces First Quarter 2024 Financial Results
Headlines for Wednesday May. 08, 2024
Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification
Arasan announces the ISO26262 functional certification of its Total MIPI Camera IP Solution as a seamlessly integrated combination of its MIPI CSI-2 Tx / Rx and C-PHY IP- Silvaco Announces Pricing of Initial Public Offering
- sureCore announces successful tape-out of cryogenic IP demonstrator
Headlines for Tuesday May. 07, 2024
Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
Siemens Digital Industries Software today introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.Headlines for Monday May. 06, 2024
Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
The transaction, valued at up to $2.1 billion, is expected to close in the second half of 2024, subject to customary closing conditions including the receipt of required regulatory approvals.- GUC Monthly Sales Report - April 2024
- Zhuhai Chuangfeixin: OTP IP Based on 55nm High-Voltage Process Successfully Qualified for Listing
- Arm Brings Transformers to IoT Devices
- BrainChip and Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- A Conversation with GlobalFoundries Europe's Manfred Horstmann
- oneNav announces the first L5-direct GNSS receiver technology
- Q3 FY24 Quarterly Activities Report: Weebit Nano advancing negotiations with partners and customers; demonstrates ReRAM robustness
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free
Headlines for Friday May. 03, 2024
Latest News- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Arteris Announces Financial Results for the First Quarter 2024 and Second Quarter and Full Year 2024 Guidance
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
Headlines for Thursday May. 02, 2024
Latest News- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
Headlines for Wednesday May. 01, 2024
Packetcraft Delivers Bluetooth Software Enabling Channel Sounding to Early Access Licensees
Channel Sounding is set to deliver high-accuracy distance measurement for secure access, location-based services and asset tracking in automotive + IoT markets- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance
- Rapid Silicon Introduces Revolutionary Rapid eFPGA Configurator for Hassle Free Embedded FPGA Evaluation
Headlines for Tuesday Apr. 30, 2024
Latest News- Silvaco Announces Launch of Initial Public Offering
- Rambus Reports First Quarter 2024 Financial Results
Headlines for Monday Apr. 29, 2024
TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 chipmaking process, which analysts say may be a leap ahead of Intel’s 18A node.- EDA toolset parade at TSMC's U.S. design symposium
- Altera in negotiation on private equity partner
- Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
- Arm China's ex-CEO sets up RISC-V company
- CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility
Headlines for Friday Apr. 26, 2024
TSMC plans 1.6nm process for 2026
TSMC is planning a 1.6nm process, called A16, for production in 2026 alongside a wafer-scale chiplet substrate and an automotive chiplet process.- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
Headlines for Thursday Apr. 25, 2024
M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Headlines for Wednesday Apr. 24, 2024
TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing