Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner

Partnership will enable FFSA and ASIC solutions on GLOBALFOUNDRIES technologies

Santa Clara, Calif., April 21, 2014 – GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GLOBALFOUNDRIES’ technologies and services for customers across the globe.

The agreement includes participation on multi-project wafer (MPW) runs and production wafers covering the whole portfolio of GLOBALFOUNDRIES technologies, including leading-edge process nodes.

Initially, the partnership will focus on implementations of Toshiba’s FFSAs manufactured with GLOBALFOUNDRIES’ 65nm and 40nm low-power process technologies, with 28nm arrays to follow. Toshiba’s FFSA products—including libraries and intellectual property (IP)—allow customers to reduce development time and costs by customizing existing base wafers, choosing from a number of design platforms at GLOBALFOUNDRIES. For higher-volume applications, customers can work with Toshiba’s libraries to develop fully custom system-on-chips (SoCs). With an initial product completed, customers can then leverage the embedded FFSA technology to provide quick-turn derivative products, with much lower development costs.

“We are very pleased to join GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner.” said Tatsuo Noguchi, Vice President, Toshiba Corporation Semiconductor & Storage Products Company. “Our FFSATM products, developed with BaySand licensed technology and in collaboration with BaySand Inc. of the U.S., can be configured simply by customizing the design of a few metal layers, and satisfy increasing market needs for high performance and low power technologies. We believe that GLOBALFOUNDRIES customers will benefit from our FFSATM.”

“We are excited to have Toshiba, one of the world’s leading semiconductor companies, join our GLOBALSOLUTIONS ecosystem,” said Chuck Fox, senior vice president of worldwide sales at GLOBALFOUNDRIES. “Toshiba has a strong track record of providing ASIC solutions throughout the world. We believe that many of our customers will benefit from the combination of Toshiba’s world-class design resources and our proven 65nm, 40nm, and 28nm process technology.”

GLOBALSOLUTIONS is the sum of GLOBALFOUNDRIES' internal resources and ecosystem partners, combined to efficiently enable the fastest time-to-volume for GLOBALFOUNDRIES' customers. The GLOBALSOLUTIONS ecosystem includes partners in all aspects of design enablement and turnkey services, OPC and mask operations, and advanced capabilities in assembly solutions.

ABOUT GLOBALFOUNDRIES
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GLOBALFOUNDRIES is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company (ATIC). For more information, visit http://www.globalfoundries.com