Small-size ISP (Image Signal Processing) IP ideal for AI camera systems.
Common Platform in Preparation for SOI, FinFETs at 10nm
Peter Clarke, Electronics360
08 April 2014
A team of engineers from IBM Microelectronics, Globalfoundries, Samsung, STMicroelectronics and UMC are due to present a 10nm logic platform that supports FinFETs on both bulk CMOS and on silicon-on-insulator wafers.
The presentation of paper 2.2 is set to be one of the highlights of the Symposium on VLSI Technology due to take place June 9 to 12 at Honolulu, Hawaii. It represents a coming together of the interests of the FinFET and fully-depleted silicon-on-insulator (FDSOI) camps, but not yet a complete merging.
E-mail This Article | Printer-Friendly Page |
Related News
- GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
- SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
- Analog Bits Announces Foundation Analog IP Availability on GLOBALFOUNDRIES 12LP FinFET Platform
- Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India