20 Most Popular News
Updated: Sat, 27 Apr 2024 01:00:02 +0200
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Controversial former Arm China CEO founds RISC-V chip startup A number of former Arm China employees have reportedly followed Allen Wu to new venture |
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2 | New!!! |
Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System The partnership aims to bolster the development and technical support of ISO 26262, the international standard for the functional safety of automotive electrical and electronic components. |
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TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. |
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4 | New!!! |
TSMC plans 1.6nm process for 2026 TSMC is planning a 1.6nm process, called A16, for production in 2026 alongside a wafer-scale chiplet substrate and an automotive chiplet process. |
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5 | New!!! |
M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development. |
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Leveraging Cryogenics and Photonics for Quantum Computing While sureCore focuses on cryogenic semiconductor design, Quantum Computing works on photonics-based technologies. |
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Numem at the Design & Reuse IP SoC Silicon Valley 2024 umem, the pioneering provider of Memory SOC IPs and Chip/Chiplets, is excited to announce that Numem CEO Jack Guedj will discuss cutting-edge memory solutions at the Design & Reuse IP SoC Silicon Valley 2024 event, which will take place on April 25th, 2024, at the Hyatt Regency Santa Clara, CA. |
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Credo at TSMC 2024 North America Technology Symposium Credo Technology is set to showcase its latest SerDes IP and Chiplet technology at three upcoming Taiwan Semiconductor Manufacturing Company (TSMC) Symposium events in 2024. |
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Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/SDR/AI solutions, announced that it now has over 100 total worldwide patents and applications on fundamental inventions that enable the best reconfigurable solutions for FPGA, DSP/SDR and AI. |
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Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process Huawei’s latest smartphone, the Mate 60 Pro, contains a 7nm HiSilicon Kirin processor made on SMIC’s N+2 process, concludes TechInsights. |
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Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones Today at the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with longtime partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes. |
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Rambus Advances AI 2.0 with GDDR7 Memory Controller IP As the latest addition to the Rambus portfolio of industry-leading interface and security digital IP for AI 2.0, the GDDR7 memory controller will provide the breakthrough memory throughput required by servers and clients in the next wave of AI inference. |
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Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology |
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Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design Cadence Design Systems, Inc. (Nasdaq: CDNS) and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. |
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15 | New!!! |
Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30% The latest update brings advanced features to the AMALIA toolset including estimated parasitics for enhanced design accuracy and a faster migration process for semiconductor IP design engineers. |
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RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions RAAAM Memory Technologies, a start-up company that invented a groundbreaking solution to implement on-chip memory, announced today that it has completed a Seed financing round of $4 million. |
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Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) introduce a new integrated radio frequency (RF) design migration flow from TSMC's N16 process to its N6RF+ technology to address the power, performance, and area (PPA) requirements of today's most demanding wireless integrated circuit applications. |
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Cadence Reports First Quarter 2024 Financial Results Record First Quarter Backlog of $6.0 Billion and cRPO of $3.1 Billion; Raising 2024 Revenue Outlook |
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Faraday Reports First Quarter 2024 Results Revenue for 1Q24 was NT$2,579 Million with a Reported EPS of NT$1.13; NRE More Than Doubled Quarter-Over-Quarter, Setting a New Record High |
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20 | New!!! |
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed comprehensive silicon testing, validating 3DIC interface hardening flow. The first GUC 3D customer project also passed complete silicon testing, validating a full spectrum of 3D implementation services for AI/HPC/Networking applications. |