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TSMC April 2008 Sales Report (May. 09, 2008)
TSMC today announced its net sales for April 2008: on an unconsolidated basis, sales were NT$28,094 million, an increase of 5.8 percent over March 2008 and an increase of 24.8 percent over April 2007. |
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Intel, Samsung Electronics and TSMC Reach Agreement for 450mm Wafer Manufacturing Transition (May. 06, 2008)
Intel, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012 |
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SMIC and Amlogic in Commercial Production of 90nm Digital Photo Frame Chip (Apr. 24, 2008)
The chip, used in the fast-growing digital photo frame market, is the most integrated multimedia SOC on the market. It supports multiple video and photo format decoding and integrated numerous advanced peripherals like high-speed USB and LCD controls. |
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TSMC Unveils New 40/65-Nanometer SPICE Tool Qualification Program (Apr. 22, 2008)
Targeting TSMC’s 65-, 40-nanometer (nm) and smaller geometry process technologies, the program’s benefits include improved device model accuracy, enhanced simulation efficiency, and compatibility across a wide selection of qualified SPICE simulators. |
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Winbond Electronics Corporation and Qimonda AG Announce New Agreement for 65 nanometer Buried Wordline Technology Transfer (Apr. 22, 2008)
The agreement, referring to a new DRAM technology roadmap unveiled by Qimonda, will replace the existing contract of 58nm DRAM trench technology transfer between the two companies. |
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SMIC and ASTRI Collaborate on the Development of the World's First Dual Mode UWB MAC ASIC Supporting Both WiMedia Compliant WLP and China IGRS Networking Applications (Apr. 21, 2008)
SMIC and ASTRI today jointly announced their partnership to provide the world’s first dual mode UWB MAC IC using SMIC’s 0.13um mix-mode CMOS technology. |
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TSMC Announces Power Trim Service for Advanced Chip Leakage Power Reduction (Apr. 15, 2008)
TSMC today announced that it has signed an exclusive agreement with Blaze DFM, Inc. to offer Power Trim Service, a new service offering combining a patented Blaze power optimization technology with special variations of TSMC's advanced manufacturing process. |
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TSMC March 2008 Sales Report (Apr. 10, 2008)
TSMC today announced its net sales for March 2008: on an unconsolidated basis, sales were NT$26,562 million, a decrease of 6.4 percent from February 2008 and an increase of 21.2 percent over March 2007. |
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New X-FAB 0.18 Micrometer Process Maximizes Cost-Effectiveness in Analog/Mixed-Signal Chip Design for Commercial Automotive and Power Management Applications (Apr. 08, 2008)
Industry’s lowest-mask-count modular 0.18 micrometer foundry process combines digital, analog, lowest Ron high-voltage, and embedded non-volatile memory options |
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Chartered Extends Technology Development Collaboration with IBM to 22-Nanometer Process Node (Apr. 02, 2008)
Chartered Semiconductor Manufacturing today announced the extension of its joint development collaboration with IBM to include 22-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) technology. Financial terms were not disclosed. |
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Tower Semiconductor Ramps-Up Production of N-trig's Digitizer Chips (Mar. 27, 2008)
Tower Semiconductor and N-trig combining pen and zero-pressure touch for mobile computers into a single device, today announced ramp-up of production of N-trig’s A-trig and D-trig – the newest digitizer chipset to be integrated in OEMs computer systems. |
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TSMC First to Deliver 40nm Process Technology (Mar. 24, 2008)
The new node supports a performance-driven general purpose (40G) technology and a power-efficient low power (40LP) technology. It features a full design service package and a design ecosystem that covers verified third party IP, third party EDA tools, TSMC-generated SPICE models and foundation IPs. First wafers out are expected in the second quarter of 2008 |
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UMC and Elpida Partner to Serve Japan-based Foundry Customers (Mar. 17, 2008)
Under this agreement, Elpida will provide its 300mm wafer manufacturing capacity while UMC will contribute the IP support and logic technologies. The joint effort, targeting Japanese foundry customers, will commence at Elpida's 300mm fab in Hiroshima using advanced technologies and applications, including system on chip |
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IBM and Hitachi Form Research Collaboration to Study Chip Characteristics at Near Atomic Scale (Mar. 10, 2008)
The new collaboration will focus on 32-nm and beyond semiconductor research and will use new methods that include the latest technologies to analyze semiconductor devices and structures in order to improve the characterization and measurement of transistor variation -- as well as to develop a better understanding of device physics |
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TSMC February 2008 Sales Report (Mar. 10, 2008)
TSMC today announced its net sales for February 2008: on an unconsolidated basis, sales were NT$28,382 million, a decrease of 6.3 percent from January 2008 and an increase of 37.9 percent over February 2007. Revenues for January through February 2008 totaled NT$58,668 million, an increase of 41.6 percent compared to the same period in 2007. |
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TSMC Announces Reorganization to Improve Structural Profitability and Strengthen Customer Partnership (Feb. 29, 2008)
TSMC announced today that it has approved the request of Dr. Kenneth Kin, Senior Vice President of Worldwide Sales and Service, to retire at the end of this year. |
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Sun Selects TSMC to Fab 45-Nanometer and Future Generation Processors (Feb. 19, 2008)
Sun Microsystems today announced that it had selected TSMC as its foundry partner for processors based on a 45-nanometer design as well as future generations. |
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Jazz seeks 'strategic alternatives' (Feb. 14, 2008)
Is Jazz Technologies Inc. the first victim in the foundry shakeout in 2008? It appears so, as the company appears to be up for sale. |
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TSMC January 2008 Sales Report (Feb. 14, 2008)
TSMC today announced its net sales for January 2008: on an unconsolidated basis, sales were NT$30,286 million, an increase of 4.0 percent over December 2007 and an increase of 45.2 percent over January 2007. |
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Texas Instruments new process techniques solve low-power challenges in delivering company's first 45 nanometer wireless device (Feb. 06, 2008)
Texas Instruments today disclosed process and design advancements enabling the first 45 nanometer (nm) 3.5G baseband and multimedia processor addressing critical power challenges in the wireless market |
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Chartered Secures Additional Financing for Fab 7 (Jan. 29, 2008)
Chartered Semiconductor Manufacturing Ltd., one of the world’s top dedicated foundries, announced that it has signed an agreement for a US$190 million term loan facility from Societe Generale. |
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STMicroelectronics Makes 45nm CMOS Process Available Through CMP (Jan. 21, 2008)
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Foundry model under stress (Jan. 16, 2008)
After years of success, the silicon foundry model may be falling apart. |
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TSMC December 2007 Sales Report (Jan. 10, 2008)
TSMC today announced its net sales for December 2007: on an unconsolidated basis, sales were NT$29,120 million, a decrease of 3.4 percent from November 2007 and an increase of 30.1 percent over December 2006. Full-year sales for 2007 totaled NT$313,648 million, a decrease of 0.1 percent compared to 2006. |
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TSMC Announces Multi-layer Mask Service (Dec. 31, 2007)
TSMC today announced the foundry industry’s first multi-layer mask service (MLM) for 90nm, 80nm and 65nm advanced process technologies. |
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SMIC and IBM Sign Licensing Agreement (Dec. 26, 2007)
SMC and IBM today announced that they have signed an agreement to license IBM's 45-nanometer bulk complementary metal-oxide-semiconductor (CMOS) technology to SMIC for 300mm wafer foundry service |
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TSMC Unveils New 65-Nanometer Mixed-Signal and RF Tool Qualification Program (Dec. 13, 2007)
Taiwan Semiconductor Manufacturing Company, Ltd. today unveiled a comprehensive Electromagnetic (EM) Tool Qualification Program that drives its Design Service Ecosystem partners to ensure greater accuracy of EM simulators and extractors used in applications such as high-speed digital clock circuits and high-frequency mixed-signal RF designs. |
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TSMC Reports Foundry's First 32-Nanometer Technology with Functional SRAM (Dec. 11, 2007)
TSMC today announced it has developed the first 32-nanometer (nm) technology that supports both analog and digital functionality. |
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UMC Releases 65nm DFM Design Enablement Kit (Dec. 11, 2007)
UMC today announced the release of its comprehensive all-in-one 65nm design for manufacturing (DFM) support package. The new DFM Design Enablement Kit (DEK) encompasses all the models required by qualified model-based DFM tools that support UMC's 65nm process technology. |
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UMC's 90nm URAM Used in Mobile TV Applications (Dec. 10, 2007)
UMC today announced that DiBcom has successfully adopted UMC’s URAM embedded memory solution for its 90nm products manufactured at the foundry. |
