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Fabless / IDM News

  • PLX Launches Industry's First PCI Express Switches With Integrated DMA (Aug. 18, 2008)
  • Ambric Announces Strategic Partnership with Pixellexis (Aug. 11, 2008)
    Ambric has selected Pixellexis Systems & Technologies as a strategic partner for development of an ISO/IEC 15444-compliant JPEG2K codec.
  • DivX Certifies High-Definition Chip from Broadcom for HDTVs and Set-Top Boxes (Aug. 11, 2008)
    DivX, Inc. (NASDAQ:DIVX), a digital media company, today announced the high-definition (HD) DivX Certification™ of Broadcom Corporation's BCM7405 system-on-a-chip (SoC) solution.
  • Integrated WiMAX SoC Platform and RF-to-Digital Baseband Transceivers Enable Range of Powerful WiMAX Femto, Pico and Micro Base Stations and Relays (Aug. 04, 2008)
    DesignArt Networks integrates Analog Devices’ WiMAX/WiBRO RF transceivers with its DAN2400 SoC platform
  • Mindspeed and ARM Deliver Dual-Core Comcerto(R) 100 Processors With Leading Performance/Low Power (Jul. 29, 2008)
    The Comcerto 100 provides the leading performance-power-cost profile in its class, delivering 2 Gbps at 1.7W power with two channels of voice-over-IP (VoIP). The integrated system-on-chip (SoC) features two ARM1136J-S(TM) processors, offering broadband gateway manufacturers a single-chip solution with an attractive bill-of-materials (BOM) cost.
  • Open-Silicon, Inc. Announces Corporate Expansion in Response to Rapid Business Growth (Jul. 29, 2008)
    Joining Open-Silicon are William J. DeWilkins, director of test, Al Di Cicco, senior director of sales, Cyrus Fathi, director of quality and reliability, and Robert Fulton, senior staff IP applications engineer.
  • Redpine Signals' Lite-Fi(TM) 802.11n SoC is Among the First Devices Certified by the Wi-Fi Alliance(R) for Voice-Over-Wi-Fi(R) Applications (Jul. 23, 2008)
    Redpine's Lite-Fi(TM) solution is Wi-Fi CERTIFIED 802.11n draft 2.0 and Voice-Personal by the Wi-Fi Alliance.
  • Oxford Semiconductor Unveils New Consumer Network-Attached and Direct-Attached Storage Solution-on-a-chip Platforms (Jul. 21, 2008)
    Aimed at the emerging personal shared network-attached storage (NAS) market, Oxford introduced the highly integrated OXE810x NAS platform, designed for bridging between Ethernet and up to two serial advanced technology attachments (SATA) hard disks.
  • Cavium Networks to Acquire Taiwan-Based Star Semiconductor (Jul. 16, 2008)
    Star Semiconductor is a Taiwan-based design house in Hsinchu with expertise in building highly integrated ARM-based SOC processors for the broadband, connected home and SOHO market segments
  • Numonyx and Elpida collaborate to deliver NOR flash memory through 300MM fab (Jul. 10, 2008)
    Elpida Memory and Numonyx today announced they have signed a letter of intent to enter into a foundry agreement for Numonyx to utilize Elpida’s leading-edge 300mm wafer fab in Hiroshima to manufacture NOR flash memory.
  • Conexant to Acquire Freescale's "Sigmatel" Multi-Function Printer Product Lines (Jul. 08, 2008)
    Transaction Will Create a Leading Provider of Semiconductor Solutions for MFPs and Facsimile Imaging Applications
  • Renesas Technology Releases SuperH Family Microcontroller, the SH72544R, Featuring 200 MHz Operation and 2.5 Mbytes Large-Capacity On-Chip Flash Memory (Jul. 07, 2008)
    Optimal for implementing high-precision power-train control, the SH72544R is based on the 400 MIPS real-time processing SH-2A CPU core and features a large-capacity on-chip flash memory
  • eASIC and Northwest Logic Deliver Low Cost, Silicon-Proven, 533 Mbps DDR2 SDRAM Solution (Jul. 01, 2008)
    eASIC based DDR2 SDRAM Solution Provides 60% Higher Performance than Mainstream Low-Density FPGAs
  • Sital Announces the Release of OCTAVA, a family of DDC MiniACE Compatible Devices (Jun. 25, 2008)
    The OCTAVA™ family integrate Mil-Std-1553 protocol engine, a dual 5-volt transceiver, memory management, processor interface logic and 4K or 64K words of RAM in a 72 pin Plastic Quad Flat Pack (PQFP) package.
  • Atmel Announces ARM Cortex-M3 License and AT91SAM3 Flash MCU Family (Jun. 24, 2008)
    Atmel's planned AT91SAM3 Flash MCU family will combine the ARM Cortex-M3 processor with the outstanding system implementation features that have placed the AT91SAM series at the forefront of its market
  • Sigma Designs Announces CoAir, the World's First Ultrawideband Chipset With Integrated Wireless, Coax and Gigabit Ethernet for High Speed Whole Home Networking (Jun. 24, 2008)
    Company's Innovative UWB System-on-a-Chip Offers Triple Communications Power for HD Multimedia Streaming and Home Data Networking
  • Jennic first to introduce 32-bit ZigBee PRO wireless microcontroller (Jun. 23, 2008)
    Jennic announces the introduction of a ZigBee PRO software stack to run on its JN5139 32-bit single chip wireless microcontroller.
  • Frontier Silicon announces unified multi-region digital radio receiver (Jun. 23, 2008)
    The new receiver addresses the market need for a solution that supports all Eureka-147 based standards, including DAB and DAB+ and DMB-Audio.
  • Eight-core microprocessor from Freescale redefines state-of-the-art for embedded multicore processing (Jun. 16, 2008)
    The signature member of Freescale's new QorIQ product line, the P4080 multicore processor is based on 45-nm process technology. It integrates enhanced Power Architecture™ cores, a tri-level cache hierarchy, innovative CoreNet™ on-chip fabric and datapath acceleration to deliver exceptional performance within a 30W maximum power envelope.
  • Enhanced Zatara(TM) ARM(R)-Based ASSP From Zilog Adds Integrated Security Features, On-Chip USB for Reduced BOM Costs and Faster Time-to-Market (Jun. 12, 2008)
    PCI-PED, Single-Chip Solution Offers Highest Levels of Integration, Dual-Role USB OTG Controller, and Reduced External Component Count for Better Overall System Security
  • DesignArt Networks Unveils 4G Silicon Platform and Delivers Fully Integrated WiMAX SoC (Jun. 09, 2008)
    DesignArt's highly integrated system-on-chip (SoC) platform architecture integrates high-capacity backhaul capability with standards-compliant WiMAX and LTE base station functionality, delivering zero-cost backhaul solutions.
  • CSR launches the world's most highly integrated wireless single chip (Jun. 03, 2008)
    BlueCore7 is the world's first device integrating Bluetooth v2.1+EDR, Bluetooth low energy, eGPS (enhanced Global Positioning System), and FM transmit and receive technologies on a single chip
  • Broadcom Announces Groundbreaking 65 Nanometer Single-Chip Bluetooth 2.1 + EDR Solution for Mobile Handsets (Jun. 03, 2008)
    Developed in a highly advanced 65 nanometer CMOS process, the new system-on-chip (SoC) solution targets mobile handset applications and includes the unique Broadcom® SmartAudio™ sound and voice enhancement technology that was previously available only in wireless headset products.
  • STMicroelectronics Strengthens Position in Wireless Segment (May. 27, 2008)
    STMicroelectronics today announced the intention of ST and EMP (Ericsson Mobile Platforms) to, within the existing partnership, also develop an analog baseband for a future high-volume EMP platform.
  • NEC Electronics Introduces Cost-Effective EMMA SoCs with Built-In Support for Next-Generation H.264 Video Compression Standard (May. 26, 2008)
    The new EMMA3SL/HD™ and EMMA3SL/SD™ devices enable users to build set-top boxes (STBs) and digital TVs (DTVs) with next-generation H.264 video compression standard, which offers twice the compression ratio as the current MPEG2 standard. The EMMA3SL/SD system-on-chip (SoC) supports standard-definition video broadcasts, while the EMMA3SL/HD SoC supports high-definition broadcasts.
  • STMicroelectronics Introduces First 65nm SPEAr(R) Customizable Chip for Computer Peripherals Applications (May. 26, 2008)
    ST's SPEAr (Structured Processor Enhanced Architecture) concept uniquely combines cost savings and shorter time-to-market of open-market standard products with the flexibility of application-specific ICs in optimizing system performance. Transfer of the SPEAr family to 65nm process technology yields increased density, performance and power-reduction features in new SPEAr devices.
  • eSilicon Achieves Significant Milestone by Booking Production Orders from More Than Fifty Customers (May. 22, 2008)
    These orders cover devices in process technologies up to 90nm, addressing the communications, networking, storage, digital imaging, consumer and security markets.
  • Conexant Launches World's First Family of Speakers-on-a-Chip Semiconductor Solutions (May. 19, 2008)
    The CX20562 integrates key speaker technology and processing functionality into a single device, and is targeted at products that support high-definition audio and voice applications.
  • ASOCS Unveils World's First Wireless MultiComm Processor (May. 19, 2008)
    Revolutionary, Single-Chip to Boost Wireless Convergence, Enables Non-Stop Connectivity Across WiFi, Cellular, and HD Digital Television Networks
  • K-micro and AnSem form a strategic partnership to develop chipsets for the home networking market (May. 14, 2008)
    The first product that has been developed is an AFE (Analog Front End) chip that enables higher performance, lower cost home network devices