 |
Hynix - ProMOS Sign Amendment to Strengthen Long-term Strategic Alliance (May. 08, 2008)
According to the Amendment, Hynix licenses to ProMOS 50 nanometer-class DRAM stack process technology, while ProMOS offers to Hynix such DRAM products from its 300mm fab capacity. |
| |
Zilog Partners With ARM for New 32-Bit Microcontroller Solutions (May. 08, 2008)
Zilog today announced it has extended its microcontroller (MCU) market strategy by licensing the ARM® Cortex(TM)-M3 processor to develop a new family of industry leading 32-bit based solutions |
| |
ChipX Mixed-Signal ASIC Processes and Procedures Satisfy DO-254 Standard (Apr. 22, 2008)
ChipX Is Now Ready to Offer DO-254 Certification Support for Aerospace and Military ASIC Projects |
| |
Legend Silicon Releases 3rd Generation DTV Demodulator Chip (Apr. 18, 2008)
With its industry-leading single-carrier and multi-carrier performance, the LGS-8G52 is the first and most ideal 2-in-1 chip solution on the Chinese DTV market. |
| |
RC Module announces new SD/HD H.264 Decoder SoC aimed at Russian DVB market (Apr. 15, 2008)
RC Module announces its SD/HD H.264 Decoder SoC – a fully programmable highly integrated SD/HD set-top box decoder based on the ARM 1176JZF-S™ host CPU core, and highperformance stream co-processor based on NeuroMatrix® DSP technology. |
| |
Gennum Delivers Low Power, PCI Express 2.0, Infiniband Repeater for System Interconnects (Apr. 14, 2008)
The low power, four-channel GN1406 device supports PCI Express (PCIe) 2.0 and Infiniband and combines the Gennum ClearEdge™ CDR and high-gain equalization technologies. |
| |
Global Unichip Announces First Full Service SiP Production Flow in the Fabless ASIC Industry (Apr. 14, 2008)
With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements |
| |
AMCC and Redpine Signals Collaborate on Next Generation Power Architecture-Based Embedded Wi-Fi Connectivity Solutions (Apr. 14, 2008)
Redpine's Lite-Fi(TM) product family offers best-in-class 802.11n with AMCC's PowerPC 405EX and EXr processors |
| |
STMicroelectronics Achieves Highest Memory Density for ARM9 Standard MCUs, Delivering Pin- and Function Compatibility with Embedded Flash of 288 Kbytes to 2.1 Mbytes (Apr. 11, 2008)
STMicroelectronics has increased the on-chip Flash capacity of its STR91xFA ARM966E-S based MCU family by introducing 1.1 Mbyte and 2.1 Mbyte variants, delivering higher memory density than any other ARM9, or ARM7-TDMI, based standard MCU currently available. |
| |
STMicroelectronics and NXP Merge Wireless Businesses to Expand Product Breadth and Boost Innovation (Apr. 11, 2008)
The new company will have the scale to better meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity and all future wireless technologies. |
| |
Gennum Delivers Industry's First Single-Chip HD and 3Gb/s Transmit and Receive Solutions (Apr. 07, 2008)
Gennum has developed the industry’s first single-chip transmit and receive solutions to support 3 gigabits per second (Gb/s), as well as high definition (HD) and standard definition (SD), for serial digital interface (SDI) applications. |
| |
GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g (Apr. 02, 2008)
GCT Semiconductor today announced the world's first highly integrated single-chip solution, GDM7215, supporting mobile WiMAX (IEEE 802.16e WAVE 2) and WiFi (802.11b/g). GDM7215 implements mobile WiMAX RF/MAC/PHY and WiFi RF/MAC/PHY on a monolithic die. |
| |
Beceem Introduces World's First Single-Chip, 65 Nanometer Mobile WiMAX Solution - Sets New Standard for Low Power Consumption (Apr. 01, 2008)
The BCSM250 is Beceem’s 4th generation of WiMAX chips and the first WiMAX solution to combine a baseband processor, dual-band 2 GHz & 3 GHz radio, memory, power management unit and host interfaces based on 65 nanometer technology in a single chip |
| |
STMicroelectronics, Intel and Francisco Partners Close Transaction to Create Numonyx (Mar. 31, 2008)
STMicroelectronics, together with Intel and Francisco Partners today announced the closing of their previously announced Numonyx joint venture |
| |
QuickLogic Speeds Hard Disk Drive Transfers With New Proven System Block (Mar. 25, 2008)
QuickLogic has developed an UltraDMA (UDMA) system block for its Customer Specific Standard Product (CSSP) platforms. Created in conjunction with CSSP customers, the UDMA block speeds data transfers to mass storage while reducing system power requirements. |
| |
Broadcom Demonstrates Industry's First Single-Chip High Definition Set-Top Box Solution With China AVS Support (Mar. 21, 2008)
The highly integrated system-on-a-chip (SoC) solution will enable set-top box manufacturers to rapidly design and deploy HD boxes compliant with China's new AVS specification. |
| |
Spiral Gateway announces working test chip (Mar. 20, 2008)
Spiral Gateway announces fully functional and validated samples of its RICA test chip; the Reconfigurable Instruction Cell Array (RICA) technology is targeted to meet the demands of image signal processing in the next generation of mobile phones. |
| |
Jade Tech Announces multimedia SoC designed for portable and embedded application (Mar. 06, 2008)
A100 is a highly integrated multimedia SoC designed for portable and embedded application. It integrates two ARM7TDMI cores and high performance complex FFT processor, as well as 512KB on-chip high speed memory which avoid the requirement for external memory devices. |
| |
eSilicon Licenses Avago Technologies' High Performance Embedded SerDes Cores (Feb. 27, 2008)
eSilicon today announced that it has reached an agreement to license Avago Technologies' 90nm and 65nm embedded SerDes cores. The agreement allows eSilicon to offer these high performance cores as part of its custom chip development solution. |
| |
Mobileye's System-on-Chip Delivers 2nd Generation Solution for Visual Recognition and Interpretation (Feb. 27, 2008)
EyeQ2™, Mobileye's System-on-Chip (SoC) delivers a 2nd generation solution for computationally intensive applications for real-time visual recognition and scene interpretation and has cabin-grade automotive qualification for use in intelligent vehicle systems |
| |
Toshiba Launches New 32-Bit Microcontroller With ARM926EJ-S Processor (Feb. 26, 2008)
Based on an ARM926EJ-S CPU operating at up to 200 MHz, the new TMPA910CRAXBG features a built-in LCD controller with support for TFT and STN display resolutions up to 1024 by 768 pixels and an LCD data processor that provides image scaling, filtering and blending functions and offers real-time video processing for video at up to 30 frames per second. |
| |
STMicroelectronics and Freescale Joint-Design Efforts Deliver on Promise of 'First Silicon' (Feb. 26, 2008)
Companies sample first 90-nm embedded flash microcontrollers to key automotive customers |
| |
Fujitsu launches full HD multi-standard decoder device supporting both MPEG-2 and H.264 (Feb. 26, 2008)
Fujitsu Microelectronics Europe (FME) today announced the launch of a new full high-definition (HD) multi-standard video decoder device for DVB broadcasts, that decodes both MPEG-2 and H.264 compressed video up to full HD resolution (1920 dots x 1080 lines). |
| |
Renesas Technology Releases 50 New MCU Products Comprising 11 Groups, Each Built Around the R32C/100 CPU Core and Integrating High-Speed On-Chip Flash Memory (Feb. 14, 2008)
Extensive lineup of MCU solutions with peripheral functions for automotive applications, such as a FlexRay controller and CAN, and al variety of on-chip flash memory capacity,for an excellent balance of cost to performance |
| |
STMicroelectronics Announces Complete Fully Integrated NFC (Near Field Communication) System-on-Chip (Feb. 13, 2008)
New flexible secure IC from ST offers fast and easy NFC technology implementation in mobile phones and consumer products, enabling short-range wireless services such as payment and transport applications |
| |
Qualcomm Makes Next-generation Mobile Internet Accessible with New Single-chip Solution (Feb. 11, 2008)
With support for downloads of up to 10.2 Mbps, uploads of up to 5.76 Mbps, compelling multimedia content and integrated Bluetooth/FM/GPS, the QSC6295 is helping drive the migration of popular Internet community and media sharing services to the mobile space. |
| |
Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards for Cell Phones (Feb. 11, 2008)
Samsung Electronics unveiled today the S3C4F60, a 65nanometer (nm) single-chip mobile TV System-on-Chip (SoC) which combines a channel decoder with an RF chip. |
| |
RMI Corporation Launches Industry's First Quad-Core Multi-Threaded Processor With Integrated Serial RapidIO Interface and IEEE1588 Controller for Wireless Base-Station Markets (Feb. 11, 2008)
The XLS Processor™ is a feature-rich general purpose processor with application specific autonomous hardware accelerators and multiple on-chip interconnect options providing an ideal combination of high level programmability, performance scalability, and intelligent packet management. |
| |
SIDSA launches the World's first demodulator plus application processor Silicon for Portable and Mobile TV (Feb. 01, 2008)
This new chipset complements the current offering of Intellectual Property for DVB-H demodulator. The Enter e1 demodulator chipset provides best-in-class performance, specially in high speed conditions or high spectrum operation. |
| |
Ambarella Introduces New Chip for Simultaneous Capturing High Resolution Stills and HD Video for Hybrid Cameras (Jan. 28, 2008)
Working at a data capture rate as fast as 480Mpixels-per-second, the A390's speed exceeds 60 frames-per-second at 8Mpixels. The A390 SoC is the third member in the A3 SoC platform series targeted at hybrid cameras and supports the emerging H.264 AVC video standard. |
