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Aniotek Selects ChipX Structured ASIC for Fieldbus Controller (Jun. 29, 2007)
ChipX and Aniotek announced today an ongoing successful relationship for deploying Aniotek’s critical UFC100-F1 Fieldbus Controller in an easy-to-use Structured ASIC platform. |
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XMOS revealed as configurable fabric company (Jun. 18, 2007)
XMOS Ltd., a fabless semiconductor company founded by academic computer scientist David May, has been revealed as a developer of a configurable hardware fabric — which usually implies a programmable array of resources. |
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eASIC and IAR Systems Deliver e926 Development Kit for Designing Low-Cost, Customized ARM926EJTM Embedded Systems (May. 22, 2007)
The e926 Development Kit provides embedded system designers with a comprehensive application development environment. The kit includes eASIC's e926 development board, IAR Systems' software design and debug tools, as well as AMBA peripherals and reference designs that enable designers to start developing their software applications within 30 minutes. |
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eASIC Partners with Premier Technical Sales to Enhance its Customer Sales and Support for Nextreme Structured ASIC in North America (May. 14, 2007)
With this partnership, eASIC further expands its global sales channel organization to provide extensive commercial and technical support in North America for its Nextreme Structured ASIC products. Leveraging its semiconductor market experience, Premier will support the rapid customer demand of Nextreme Structured ASICs. |
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ChipX Partners with Beyond Semiconductor to Offer 32 bit Processors (May. 10, 2007)
The BA12 line of products consists of a 32 bit processor core that can be configured to include a Memory Management Unit (MMU), Power Management (PM), Instruction and Data Cache, basic peripherals as well as debug port, timers and serial port options. |
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Semico: Opportunities Abound in the Structured ASIC Market (Apr. 30, 2007)
Revenue for the Structured ASIC category grew 20% in 2006 and is projected to increase 13% in 2007 according to Semico. Unit growth of the worldwide Structured ASIC market is forecasted at a CAGR of 28.2% in the years 2007 through 2011. |
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Open-Silicon Introduces Multi-Layer Mask Program: Reduces Mask Costs by up to 50% for 90nm and Smaller Lithographies (Apr. 09, 2007)
Open-Silicon today announces a multi-layer mask program that offers ASIC customers a new option for cost-effective low and mid-volume ASICs. |
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eASIC and CAST Announce the Availability of H.264 Multi-Channel Baseline Video Encoder Core for NextremeTM Structured ASICs (Mar. 27, 2007)
eASIC today announced the availability of the H264-MCE multi-channel baseline video encoder core from CAST, Inc. for implementation in Nextreme Structured ASIC devices. This Intellectual Property core, which was proven in a 90nm Nextreme fabric, demonstrated 150MHz performance and is now offered as a low-cost and fast turnaround solution for a wide range of video processing applications. |
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Altera's Structured ASIC Design Flow Now ITAR-Compliant for Military Applications (Mar. 12, 2007)
Altera today announced that the U.S. Department of State has certified that the company's HardCopy(R) II structured ASIC design and manufacturing flow is compliant with International Trade in Arms Regulations (ITAR). Compliance allows designers of U.S. military electronics systems to take advantage of a secure HardCopy II design flow for prototyping in an FPGA and then seamlessly migrating to a structured ASIC. |
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eASIC and GenCore Form Partnership for Distribution of Nextreme Structured ASIC Devices in Korea (Mar. 07, 2007)
GenCore Can Now Deliver to the Korean Designers Affordable ASICs With No Mask Charges and With an FPGA-like Ease-of-Design in a Short Time-to-Market |
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NEC shuts fabs, exits structured ASICs (Feb. 22, 2007)
Coping with a ''crisis'' amid losses in its business, troubled NEC Electronics Corp. Thursday (Feb. 22) announced a three-year restructuring plan that included the exit from the structured ASIC and single-chip cell phone sectors. The company, which is also terminating 600 engineers, will consolidate its nine front-end manufacturing lines in Japan to four. |
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ChipX Purchases OKI's U.S. ASIC Business Assets and Signs Business Collaboration Agreement (Feb. 20, 2007)
As a result of the collaboration between the two companies, Oki Semiconductor has become a turnkey foundry for ChipX and has licensed its embedded array and Gate array technology and internally developed IP to ChipX. Oki Semiconductor has assigned all of its U.S. ASIC product backlog to ChipX and has contracted the completion of the ongoing customer designs to ChipX. |
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Cellular3G Uses eASIC’s Nextreme Structured ASICs for its TopHat™ W-CDMA (3GPP) Baseband Solution (Feb. 09, 2007)
On-time and on-budget delivery of the 90nm Nextreme chips allows Cellular3G to demonstrate their leading-edge baseband technology at the 3GSM Show in Barcelona |
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ChipX Introduces Embedded Array Products as Alternatives to Standard Cell ASICs (Feb. 05, 2007)
ChipX Embedded Arrays in UMC 0.13u high-speed HS process technology are available for designs starting today. |
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eASIC and ASIC Architect Partner to Deliver New High-Speed PCI Express and DDR2 Interfaces for Nextreme Structured ASICs (Feb. 05, 2007)
eASIC Corporation and ASIC Architect today announced the immediate availability of two new high-speed interfaces for eASIC's 90nm Nextreme Structured ASIC Family: PCI Express (PCIe) Endpoint Controller and DDR2 memory controller. |
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eASIC and MoreThanIP Partner to Deliver Tri-Mode (10/100/1000) Ethernet MAC Solutions for Nextreme Structured ASICs (Jan. 29, 2007)
As a new member of eASIC’s eZ-IP Alliance, MoreThanIP will partner with eASIC to deliver UNH approved Ethernet solutions on Nextreme Structured ASICs in order to provide system designers with the advantages of low unit-cost, no mask charges, and fast turnaround alternative to FPGAs and cell-based ASICs |
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Fukuoka Intelligent Cluster Laboratory Chooses eASIC’s Nextreme Devices for its Unique System-in-Package (SiP) Development (Jan. 29, 2007)
The Nextreme 90nm Structured ASIC delivered the fast turnaround, low-cost and low-power required for the SiP implementation |
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eASIC Teams With CAST to Deliver ARM926EJ AMBA Compliant Peripherals for 90nm Nextreme(TM) Structured ASICs (Jan. 11, 2007)
The PIP-AMBA package will enable designers to successfully and rapidly build complete embedded systems using the industry standard ARM926EJ processor in a configurable logic fabric. The combination of the ARM926EJ core, the CAST PIP-AMBA and the Nextreme logic fabric enables designers to build cost-optimized custom embedded systems in a zero mask charge and no minimum order quantity. |
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SANYO Adopts Altera's HardCopy Structured ASIC for Award-Winning Home Theater Projector (Jan. 09, 2007)
SANYO is now leveraging Altera’s HardCopy® structured ASIC family with a Nios® II embedded processor for image processing and enhancement for their newest PLV-Z5 home projector. This follows SANYO’s integration of an embedded system solution using Stratix® FPGAs and Nios II processors to perform critical image enhancement functions in their previous PLV-Z4 model. |
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eASIC's Embedded ARM926EJ Processor is Available For All (Jan. 04, 2007)
eASIC implemented the 32-bit ARM926EJ processor using its standard design flow and obtained 150MHz typical performance. The 90nm Nextreme family with the embedded ARM926EJ processor is available now and is well suited for use in a vast range of applications, including digital imaging, portable media players, wired communication, wireless communication, storage and industrial. |
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Triad Semiconductor Forms Triad Alliance Program for ASIC Partners (Dec. 12, 2006)
Telesensors, Inc. Reaches Qualification as Authorized Design Center |
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eASIC rolls 90-nm structured ASIC line (Nov. 09, 2006)
Seeking to displace FPGAs and other chip technologies in the marketplace, eASIC Corp. on Wednesday (Nov. 8) came out of its shell with a bang by unveiling a new 90-nm structured ASIC line. |
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Structured-ASIC push centers on flexible platforms (Oct. 23, 2006)
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ChipX and Northwest Logic announce a complete 667Mbps DDR/DDR2 SDRAM Structured ASIC solution (Oct. 18, 2006)
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ChipX Announces USB-IF Compliance Certification for USB 2.0 HS OTG PHY in Structured ASIC (Oct. 03, 2006)
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Faraday Announces Highly-Integrated Programmable SerDes-Based Communication Platform ASIC (Oct. 03, 2006)
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Magma's Blast Create SA Used by STMicroelectronics to Deliver Industry's First Application-Specific Structured ASIC (Jul. 21, 2006)
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CPU Tech and IBM Collaborate on New Class of Semiconductor Devices; Acalis(TM) Programmable Semiconductor Devices add Flexibility, Capacity and Software Compatibility to Multi-Core Processing Solutions (Jul. 21, 2006)
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PLD Applications and Rapid Bridge Systems Announce Partnership; Innovative ASIC platform for Nanometer Technologies Reduces Risk and Shortens Time to Market for PCI Express designs (Jul. 20, 2006)
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PLDA and ChipX Announce Collaboration -- PCI Express IP Integrated in Structured ASIC to Offer Complete PCIe Solution (Jul. 19, 2006)
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