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Headline (June 2006)      Sign Up for SoC News Alert
   Headlines for Jun. 30, 2006
  • ViASIC Introduces Industry's First Two-Mask Standard Metal Fabric for Re-configurable SOC Design; DuoMask Patented Technology Provides a Complete Solution for All Processes
  • Digital Blocks Announces the Re-launch of its DB8279 Programmable Keyboard / Display Interface IP Core
  • Toshiba Licenses Staktek's NAND Flash-Memory Technologies
  • Patni Acquires US-Based ZAiQ Technologies
  • Tower Semiconductor Successfully Completes NIS 140 Million (Approximately $31 Million) Fundraising
  • Nordic Semiconductor opens regional sales office in Tokyo to further enhance its presence in the Japanese market and provide support for its existing local distributors
  •    Headlines for Jun. 29, 2006
  • Patriot Scientific Confirms PENTAX Joins Growing Roster of Global Manufacturers Licensed to Use the Moore Microprocessor Patent(TM) Portfolio
  • Scaleo chip and Wipro-NewLogic bring together their technology to reinforce their presence in the Bluetooth applications market
  • Fujitsu Introduces Its Mobile WiMAX System-on-Chip Solution and Roadmap
  • Altium releases TASKING VX-toolset for Altera's Nios II embedded processors
  • SoftRISC to Provide Robust and Reliable Voice over WiFi for Symbol Mobile Computers
  • Xilinx issues Spartan-3 recall
  •    Headlines for Jun. 28, 2006
  • Synopsys Introduces Validated USB 2.0 nanoPHY IP for TSMC'S Nexsys 90-LP Process
  • Denali's Databahn Memory Controller IP Supports Cadence Encounter Synthesis
  • Central China's First 12-inch Fab Began Construction and Will be Managed by SMIC
  •    Headlines for Jun. 27, 2006
  • Rambus Provides Update of Audit Committee Investigation Regarding Stock Option Grants
  • Patriot Scientific Corporation Confirms Seiko Epson Agreement to Purchase MMP License
  • LogicVision and Dolphin Technology Announce Integration of 90nm and 65nm memories with Comprehensive Self-test and Repair Solutions
  • NVIDIA GoForce 5500 Employs Tensilica's Xtensa HiFi 2 Audio Engine for High-Quality Audio in Mobile Phones
  • TransEDA is in winding down discussions
  • CEVA, Inc. Announces Divestment of Its GPS Technology and Product Line
  • Samsung passes on ARM power management software
  • Micronas' New Audio Processor Meets Ever-Increasing Demand for Analog and Digital I/O With a Powerful DSP for Home Audio Applications
  • GE Fanuc Embedded Systems Introduces the Industry's Only COTS 10Mbit MIL-STD-1553 PMC Module
  •    Headlines for Jun. 26, 2006
  • Avago Advances Its ASIC Technology to the Next Generation: Proves High-Performance 12.5 Gbps SerDes Core in 65 Nm CMOS Process
  • Silistix Partners with Tensilica to Develop a Demonstration Test Chip for Portable Multimedia Applications
  • Chipidea Launches New Line of CMOS Radio Frequency IP Platforms
  • Cadence and ARM Deliver Innovative Kit to Speed Verification Closure for ARM Processor-Based Designs
  • ARC and Cadence Announce Optimized Integration of Encounter Digital IC Platform with ARChitect Processor Configurator
  • IMEC software-defined radio concept compliant with 3GPP-LTE
  • Wi-LAN's completes closing of $8 million bought deal
  • Xilinx Delivers ISE 8.2i - A Complete Logic Design Solution For The New 65nm Virtex-5 FPGA Family
  • Actel's Four-Million System Gate Prototyping Solution Saves Time and Mitigates Costly Risks for Space Flight FPGAs
  •    Headlines for Jun. 23, 2006
  • Analog IC Markets Prosper in 2006
  • NEMERIX and TSMC Strike Partnership For GPS/AGPS CMOS Products
  • Imagination Technologies to Continue to Market its Next Generation Graphics Technology Directly
  • ARM Strengthens Its 3D Graphics IP Portfolio Through FALANX Aquisition
  • Actel CEO John East comments on the FPGA market metamorphosis
  • Oki Electric Adopts Elliptic Semiconductor's Ttechnology For Comprehensive DTCP Rights Management Solution
  • MOSAID Announces Fourth Quarter and Year-End Results for Fiscal Year 2006
  • Faraday Showcases Networking and Multimedia ASIC and IP Solutions at ESEC Tokyo
  •    Headlines for Jun. 22, 2006
  • WiQuest Licenses Tensilica's Xtensa Processor for Low-Power Wireless USB Chip Design
  • Sunplus named as the first TTPCom 3G Baseband Chipset Design Customer
  • Renesas Technology Develops 1GHz Synthesizable DSP Core that Uses a Technique for High-Speed Operation
  • Faraday High-Speed USB OTG PHY and Controller Solution Passes USB-IF Compliance Test
  • Arteris Strengthens Technical Organization in the U.S.; Veteran Tool Development and Application Executives Join Arteris to Accelerate Delivery of Network on Chip (NoC) Products
  • UMC's 65nm Process Sees Widespread Acceptance; UMC's Design for Manufacturing (DFM) Resources Play Major Role in Facilitating Ease of Design-in for 65nm Customers
  • Carbon Breaks Software Validation Barrier, Adds Replay to its SOC-VSP Offering
  • HDMI 1.3 Doubles Bandwidth, Delivers Billions of Colors for HDTVs
  •    Headlines for Jun. 21, 2006
  • MIPS Technologies Joins The SPIRIT Consortium
  • ARM multiprocessor could carry the load in SH-Mobile
  • Cosmic Circuits introduces industry's lowest power 10-bit 1MSPS ADC IP-block in 0.13um process
  • Samsung To Benefit From ARM And National Semiconductor Power Management Collaboration
  • Tarek Established Japan Distribution Channel with Applistar
  • Intellectual Property Servicing Centre Opens at Hong Kong Science Park; Establishes IP Servicing Platform for the Semiconductor Industry
  •    Headlines for Jun. 20, 2006
  • CAST Extends Sales Reach with West Coast Office and New Distributor in Japan
  • Imagination Technologies Formally Launches U.S. Operations;
  • Connex Technology Pick Tharas Systems' Hammer SX Hardware Accelerator To Speed Up Verification
  • Virage Logic Names Christine Russell as Vice President of Finance and CFO
  • Darfon Selects Cypress's WirelessUSB LP Radio System-on-Chip And enCoRe II MCUs For Next-Generation Wireless Mice
  • Actions Semiconductor Provides an Update on ITC Patent Infringement Lawsuit
  •    Headlines for Jun. 19, 2006
  • Actions Semiconductor Introduces 0.18 Micron Product with New Power Management Technology
  • Lattice Delivers Comprehensive IP Portfolio for LatticeSC Extreme Performance FPGAs
  • Altera's Stratix II FPGAs Provide Complete Design Security Solution for Protection of Intellectual Property
  • Impinj's AEON Nonvolatile Memory Licensed to SanDisk
  • Denali Announces Silicon-Proven PCI Express Design IP Product
  • MoSys' 1T-SRAM(R) Embedded Memory Technology Enables Nintendo's Next Leap in Video Games
  • Hantro Announces the Availability of a Full Suite of DirectShow Filters for Windows Mobile and Windows CE 5.0
  • Elpida's Advanced 90nm DDR2 SDRAM Successfully Qualified at SMIC Beijing's 300mm Fab
  • Global Unichip Presents the Taiwan First Certified High-Speed USB2.0 OTG Solution, UINF-0041
  • Knowlent Ensures Analog Sign-Off With Latest Opal Verification Platform; New 4.0 Release Offers Testbench for Up-coming PCI Express Gen 2 Standard
  • Synplicity Facilitates Open IP Encryption Methodology Standard
  • Celoxica, GiDEL Bring FPGA+DSP Acceleration to Embedded Imaging Applications
  •    Headlines for Jun. 16, 2006
  • Crocus Technology, a company focusing on Magnetic Random Access Memories (MRAM), Raises $17 Million in a Series A Round of Financing
  • Red Bend Software Joins ARM Connected Community
  •    Headlines for Jun. 15, 2006
  • Tower Semiconductor Begins Production of a Notebook Embedded Controller developed by Winbond Israel
  • SigmaTel Selects SPIRIT's High-Performance Audio Software for Portable Media Player ARM Technology-Based SoCs
  • Renesas Technology Develops Technique that Overcomes Effects of Threshold Variation to Stabilize the Operation of Embedded SRAM built with 65nm Process
  • Green Hills Software Dismisses Express Logic's Arbitration Demand as an Act of Desperation
  •    Headlines for Jun. 14, 2006
  • Mentor Graphics and Global Edge Software Bring H.264 Digital Video Standard Support to Multimedia Applications
  • Lattice Semiconductor Announces Business Update for Second Quarter; Raises Revenue Guidance
  • MOSAID and Infineon Settle Patent Litigations; Infineon and Qimonda license MOSAID patent portfolio, MOSAID purchases 50 patents from Infineon
  • Wi-LAN Announces Second Quarter 2006 Financial Results; Emerging as a Key Wireless Patent Licensing Business
  • Tower Semiconductor Manufactures Gen 2 RFID Tags for Alien Technology
  • Tendril Releases Its Software on Chipcon Platform From TI
  • Xilinx CoolRunner-II CPLDs Adopted In Wilcom's Handeld Information Terminal Manufactured By Sharp
  •    Headlines for Jun. 13, 2006
  • Fujitsu, NEC Electronics, Renesas, and Toshiba to Aim for Standardization of Semiconductor Process Technology for Next-Generation LSI
  • Raza Microelectronics, Inc. and AMD Announce Broad Strategic Relationship, Transfer of AMD Alchemy Processor Product Line
  • Synopsys to Demonstrate First Controller IP Based on Certified Wireless USB Specification at 2006 Certified Wireless USB Developers Conference
  • PMC-Sierra's New Multi-Service Residential Gateway Solution Powered by Multi-Threaded MIPS32 34K Core
  • Tri-Vision licenses U.S. V-chip to LG Electronics
  • Nikon Purchases MMP(TM) Portfolio License; Licensing Program for Fundamental Patents Continues to Attract Support of World's Top Intellectual Property Companies
  • YOGITECH Extends OCP Verification Component Functionality
  • OCP-IP Releases Functional Coverage Guidelines; Guidelines eliminate the need for ''best guess'' verification by engineers
  • Ignios runs out of time, money
  • Kilopass Offers Technical Seminars in California and Texas; Events Showcase Customer Applications for XPM Embedded Non-Volatile Memory Technology
  • Arasan Chip Systems celebrates 10 successful years in the IP Industry
  •    Headlines for Jun. 12, 2006
  • Luminary Micro Closes $14 Million in Series B Round as Demand for Stellaris(TM) MCUs and First ARM for $1.00 Continues to Grow
  • The SPIRIT Consortium Sends IP-XACT Specification to IEEE
  • Mentor Graphics Introduces Catapult SL, the First High-Level Synthesis Tool to Create High-Performance Subsystems from Pure ANSI C++
  • nSys leads the way to announce PCI Express Gen2 VIP availability in SystemVerilog
  • G2 Microsystems Adopts LogicVision's ETCompression ATPG Product
  • IP Cores, Inc. Announces Two New Multi-Gigabit IP Combo AES/LRW and AES/GCM Cores for System on Chip (SoC) Design
  • Gaisler Research receives order for the Fault Tolerant LEON3 processor implemented in an Actel RTAX2000 FPGA from ACER in Taiwan
  • MIPS Technologies Appoints Mark Tyndall VP, Business Development and Corporate Relations
  • Enea announces OSEck DSP RTOS for the LSI ZSP500 signal processor
  • Tower Semiconductor Secures a Multi-Million-Dollar Manufacturing Agreement With a Major European IC Company
  • Enea's OSEck DSP RTOS Available for StarCore SC1000 and SC2000 DSP Cores
  • Cadence Debuts Industry's First Transaction-Based System Verification and Management Solution
  • Texas Instruments 45-nm Chip Manufacturing Process Doubles Output per Wafer, Lowers Power and Boosts Performance
  •    Headlines for Jun. 09, 2006
  • TSMC May 2006 Sales Report
  • Acacia Technologies Enters into License Agreement with Philips Electronics
  • NEC Electronics America Announces New 55-Nanometer Standard CMOS Process
  • Xilinx CEO Interview: Programmable Processing
  • NextIO and Denali Team to Enable First I/O Virtualization Designs for PCI Express
  •    Headlines for Jun. 08, 2006
  • Innovative Silicon's Z-RAM Ultra Dense Memory IP Now Backed by 10th Patent; Memory Innovator Has 41 Additional Patents Pending and 5 U.S. Applications Allowed
  • Wipro acquires wireless design services company, Saraware
  • E Ink Selects Actel's Flash-Based FPGAs for Use in Next-Generation Electronic Paper Display Controller
  • Aplus Flash Technology Provides a Successful EEPROM IP solution to Datang Microelectronics
  • HiSilicon Technologies utilizes EEPROM IP from Aplus Flash Technology for its SIM cards
  • SMIC Shanghai Closed a US$600 Million Syndicated Term Loan
  •    Headlines for Jun. 07, 2006
  • US Patent Office Issues Emulation/Prototyping Patent to Zeidman Technologies
  • Synopsys' New Designware Bridge IP for PCI Express to AMBA 3 AXI Connects Two High-Performance Domains
  • MOSAID Maestro Digital Frequency Synthesizer PLL Used in WiQuest Ultra-wideband IC
  • Faraday Monthly Sales Report - May 2006
  • VIA Extends Licensing Agreement With ARM
  • Oki Announces the World's First Complete, Easy to use ARM-Based ZigBee Developer's Kit
  • Provigent Secures Additional $5 Million of Financing
  • April Semiconductor Sales up 8.1 Percent from 2005; Wireless handsets drive strong analog product sales
  •    Headlines for Jun. 06, 2006
  • SST and Grace Semiconductor Expand Availability of Embedded SuperFlash Technology With New Licensing Agreement
  • XtremeData Picks Altera's Stratix II FPGAs to Deliver Processor Acceleration for AMD Opteron Processor-Based Systems
  • PLDA and ELTEC Elektronik Collaborate on 16-Channel PCI Express High-End Frame Grabber for Security Applications
  • STARC Selects Chipidea PLL for Advanced Semiconductor Design Effort
  • Enter Triad's ASIC Design Contest and Win a Free ASIC Spin
  • Atmel Launches Industry's First Family of Real-time, Flash-based ARM9 MCUs
  • Hantro announces next generation 4200 MPEG-4 / H.263 software encoder for ARM based wireless devices
  • AMD To Provide Transmeta Efficeon Microprocessor Supporting Microsoft FlexGo Technology In Emerging Markets
  • Startech Global and Doradus Technologies Form Research and Development Partnership in Communication Systems
  • CSR provides Bluetooth connectivity for Motorola iDEN handsets in the US
  •    Headlines for Jun. 05, 2006
  • LogicVision Announces New Generation of Embedded Memory Test and Yield Learning Solutions to Meet the Growing Challenges of Advanced Technology Nodes
  • Patriot Scientific Corporation Announces Licensing Agreement With Sony Corporation
  • Altera and MorethanIP Deliver First IEEE 1588 Protocol Solution for FPGAs
  • Lattice and Northwest Logic Deliver PCI Express X1, X4 and X8 Solutions
  • Globetech Solutions Joins Novas Harmony Program
  • LongBoard and HelloSoft Form Partnership to Bring 3GPP-Compliant Fixed Mobile Convergence Solutions to Carriers and Service Providers
  • Highland Communications Technologies licenses 2.5 Gbps GPON FEC core to Iamba Networks
  • ChipX Announces New Development Kit with PCI Express PHY for CX6100 Structured ASICs
  • Renesas Technology Releases SH7263 and SH7203 SuperH Microcontrollers with On-Chip USB2.0 Host
  • Infineon Launches Breakthrough Single-Chip Home Gateway; Integrates ADSL2+ and Converged Broadband Value Added Services to Reduce System Chip Count Up to 60 Percent
  • Tower Semiconductor Files Draft Preliminary Prospectus With Israel Securities Authority for Possible Public Offering in Israel
  • Redline Selects Sequans Chips for Its IEEE 802.16e-2005 WiMAX Devices
  • India's Patni buys U.S. design house ZaiQ
  •    Headlines for Jun. 02, 2006
  • MQX Embedded and iSYSTEM Announce Integration of the MQX® RTOS with iSYSTEM Emulators
  • Aware, Inc. to Feature VDSL2 solutions at GlobalComm 2006
  • Rambus Achieves 500th Patent Milestone; Recent Patent Awards Include Innovative FlexPhase(TM) Circuit Technology
  • PLDA Expands US Presence in Response to Strong Revenue Growth in the Region
  • Inapac Technology and eSilicon Partner on SiP Program; eSilicon to Offer Inapac SIPFLOW Memory IP and Methodology to Enable SiP Applications
  •    Headlines for Jun. 01, 2006
  • AMD Announces Initiatives To Elevate AMD64 As Platform For System- And Industry-Wide Innovation
  • MOSAID Technologies: Texas Court Issues Notice
  • Five Indian firms take up ARM's DesignStart program
  • Tundra Semiconductor Acquires Silicon Logic Engineering
  • Jazz Semiconductor Announces Advanced Modeling Tool for Analog and RF Foundry Customers
  • Motorola to Acquire TTP Communications for ₤0.45 Per Share in Cash

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