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Headline (February 2006)      Sign Up for SoC News Alert
   Headlines for Feb. 28, 2006
  • Design productivity can grow by 8X, says Synopsys VP
  • Imagination Technologies opens office in Taiwan
  • IBM announces enhancements to PowerPC portfolio, new Power licensee
  • Xilinx First To 65nm With Next Generation Virtex FPGAs
  • PLDA PCI Express IP Chosen by EVE for Zebu Prototyping Platform
  • Actel Delivers Development Kit for ARM7-Enabled FPGAs
  • Innovative Semiconductor Teams with Denali to Deliver High-Quality USB OTG Solutions
  • Green Hills Software Announces New Development Tools and Operating System for Texas Instruments' DaVinci Technology
  • Celoxica and Philips TASS Team to Accelerate ESL Adoption in Europe
  •    Headlines for Feb. 27, 2006
  • IPextreme to Accelerate Power Architecture Adoption by Making Valuable Member IP Widely Available
  • Poseidon Design Systems Appoints Brian Bailey as Chief Technologist
  • French startup, Cortus SA, offers compact 32-bit RISC
  • Arteris Ships Arteris NoC Solution 1.4 to Accelerate Adoption of Network on Chip
  • Impinj Aligns With UMC to Deliver Logic NVM Cores on 0.18um and 0.13um Process Technologies
  • ARM Offers Advantage Physical IP Support For IBM, Chartered And Samsung Common Platform On 65-Nanometer Generic Process
  • Silicon Design Chain Validates Enhanced Power Management Methodology with ARM 1136JF-S
  • Akustica Launches the World's First Single-Chip Microphone
  • Vativ Announces Industry's First and Most Advanced Three Input, Dual Output HDMI Receiver Chip for Next Generation Digital TVs
  • Mercury Computer Systems and Texas Instruments Announce a WiMAX AMC for Next-Generation Mobile Broadband Market
  • SystemC finds new horizons
  • Summit Design's Vista IDE Simplifies Intellectual Property Development and Design Sharing For SystemC-Based Designs Without A Run-Time License
  •    Headlines for Feb. 24, 2006
  • Analysis: Chip design outsourcers must embrace IP
  • Transmeta Licenses its LongRun2 Technologies for Low Power and Leakage Management to Toshiba
  • Elliptic Semiconductor Ports Security IP Cores to Lattice FPGAs
  • MOSAID Announces Third Quarter Results for Fiscal Year 2006
  • Transmeta's Full Year 2005 Revenue Increases 147% To $72.7 Million
  • Dualcore DCIC9907 Industrial Microcontroller with Two ARM Cores Targeted at Time-critical Industrial Control Applications
  •    Headlines for Feb. 23, 2006
  • Silicon Image Announces HDMI IP Core Design Wins With Pixelworks and Sunplus
  • Micron Technology, Inc., Brings Lawsuit Against Rambus in Italy
  • Samsung Offers ARM Physical IP To Support 65 Nanometer Low-Power Common Platform Enablement
  • Renesas Technology Selects ARM11 MPCore Technology
  • Tensilica and CSIP of Ministry of Information Industry (MII) of PRC Establish First Joint IP Core Lab
  • MIPS Technologies Appoints Shanghai-based SinoSys Technologies as the first MIPS Authorized Training Center in China
  •    Headlines for Feb. 22, 2006
  • Texas Instruments Releases Advanced ASIC Kits, Extends ASIC Library and Support for Design Tools
  • Patriot Scientific Announces Important Patent Licensing Agreement with Casio
  • eInfochips Expands Expertise to System Validation and Reference Designs
  • Sharp Microelectronics and Actimagine Collaborate to Boost SoC Video Capabilities
  • Technology Authority Jim Turley Joins Board of Patriot Scientific
  • Semico Maintains Optimistic 17.3% Growth Projection
  • JMicron Technology Corp Develops Serial ATA II (3.0 Gpbs) PHY Core on UMC's 90nm G and 90nm SP Processes
  • Xilinx And ISR Technologies Announce Software Defined Radio Kit Supporting Partial Reconfiguration And SCA-Enabled SoC
  • TSMC Says Immersion Lithography Nearly Production Ready
  • MIPS Technologies Names Kate Rundle Vice President, General Counsel
  •    Headlines for Feb. 21, 2006
  • Next Generation Content Protection Specification - Advanced Access Content System (AACS) - Made Available for Licensing
  • Micron Technology, Inc., Files RICO Lawsuit Against Rambus
  • Casio Joins HP in Purchasing ''System'' License to Use Moore Microprocessor Patent(TM) Portfolio; Casio Reinforces Need for Digital Hardware Manufacturers to License Ubiquitous MMP Portfolio Technologies
  • National Semiconductor and ARM Release Next-Generation PowerWise Interface Open-Standard Specification
  • Actel ProASIC3 Commercial Qualification Completed
  • X-FAB Offers IP Blocks for RF Designs
  • UMC Fabricates World's Highest Frequency Silicon Circuit Using CMOS - 192-GHz Voltage-Controlled Oscillator; Push-push Voltage-Controlled Oscillator (VCO) designed by the University of Florida reaches 192-GHz Operating Frequency
  • NEC Electronics America to Distribute Tensilica's
  • Tensilica, Virage Logic and SMIC Partner to Provide Hard Macro Versions of Diamond Standard Processor Cores
  • Global Unichip and Tensilica Announced Partnership to Present Diamond Standard Series Hard Cores for SoC Design Technologies at 0.13um and Below
  • Actel Offers One Million Gates for Free
  • Impinj Extends GrandPrix Gen 2 RFID Solution to Item-Level Tagging
  •    Headlines for Feb. 20, 2006
  • Chinese Audio/Video codec rises; Domestic rival to WMV-9 and MPEG-4 nears standardization
  • Reconfigurable cores boost processor power
  • ARM Licenses 1176JZF-S Processor To NEC Electronics
  • Tensilica Introduces Diamond Standard Processor Core Family, Leading the Industry in Low Power and High Performance
  • Tensilica Introduces Diamond Standard 570T with 50% Lower Power Consumption, Twice the Performance and Half the Area of ARM11 Processor Core
  • Tensilica Introduces Fastest, Lowest Power Linux Processor Core
  • Tensilica Announces Diamond Standard 330HiFi, a Low-Power 24-bit Audio DSP
  • New ARC Video Subsystem Delivers Complete Solution for Portable Multimedia Devices
  • STMicroelectronics Inaugurates its New Design Campus in India
  • Temento Systems announces the support of System Verilog Assertions among the new features of DiaLite Platform Edition and of TemStorage
  • Celoxica Strengthens DSP-FPGA Solutions Joins Texas Instruments Third Party DSP Program
  •    Headlines for Feb. 17, 2006
  • GE Fanuc Embedded Systems Signs Agreement To Purchase Assets Of Condor Engineering
  • Aware, Inc. Reports 2005 Fourth Quarter Financial Results
  • Silicon Image Reports Fourth Quarter and 2005 Financial Results
  •    Headlines for Feb. 16, 2006
  • NaturalNano Licenses Key Patent for Selective Wireless Access in RF Shielded Environments
  • Gartner Says Worldwide Semiconductor Market Will Continue to Show Gradual Improvement in 2006
  • Innovative Silicon Inc. Ramps for Growth of Z-RAM Memory IP with New Silicon Valley Headquarters
  • Altera and TES Offer Cost-Effective FPGA-Based Reconfigurable Graphics Controller
  • Abacus Polar partners with Proven Software Solutions to create the Abacus Systems Solutions Framework
  •    Headlines for Feb. 15, 2006
  • Monolithic System Technology, Inc. Announces Fourth Quarter and Fiscal Year 2005 Financial Results
  • Wi-LAN Announces Director Resignation
  • Toshiba, NEC Electronics and Fujitsu Announce Agreement on ''COSMORAM Rev. 4'' Common Pseudo SRAM Specifications for Mobile Devices
  • Saifun Semiconductors Reports Fourth Quarter and Year-End 2005 Results
  • Haier IC Standardizes on ARM Artisan Physical IP for Consumer Electronics Applications
  • Leading Acceleration Technology Company Selects Denali for Memory System Design
  • MoSys' 1T-SRAM(R) CLASSIC Running in Volume Production on Chartered's 0.13-micron Process
  • 4i2i and LSI Logic demonstrate video solutions at Embedded World
  • Essensium NV, a Belgian fabless provider of SoC ASICs, secures 6 million euro in Malaysian funding
  • Genesys Logic Low Power USB 2.0 Digital TV Controller IC being awarded the Bus Power certification by USB-IF
  •    Headlines for Feb. 14, 2006
  • Sharp Microelectronics and Actimagine Collaborate to Boost SoC Video Capabilities; Video Decompression Rates Increase Fourfold with Same Power Use
  • EVE Raises $6 Million in New Funding
  • Texas Instruments New OMAP3 Architecture Will Spark Development of a New Class of Mobile Phones
  • Patriot Scientific Corporation Announces Unprecedented Microcap Dividend
  • ARM Announces Availability of Mobile Consumer DRM Software Solutions Based on ARM TrustZoneTechnology
  • Altera's Cyclone II FPGA Family Now Available in Extended Temperature Range
  • Accelerated Technology's Nucleus RTOS Continues Support for CDMA Chipset from VIA Telecom
  • S3 collaborates with Hantro to demonstrate DVB-H software evaluation platform
  • LSI Logic Announces Cached DSP Cores for Innovative Wireless, Voice and Multimedia Systems
  • Sequans Communications Licenses LSI Logic ZSP(R) DSP Core for Broadband Wireless Market
  • S3's onHandTV DVB-H stack integrated with multiple phone platforms from Philips
  • Xilinx Streamlines Embedded System Design With New Platform Studio Version 8.1i
  • Expway and Hantro to integrate their solutions for DVB-H and Smartphones Devices
  • Xilinx Collaborates With Xylon To Develop World's First Programmable Development Board For Automotive Infotainment
  •    Headlines for Feb. 13, 2006
  • ARM vows to fight for automotive market
  • SST And Freescale Semiconductor Sign Embedded Flash Licensing Agreement
  • Tallika's PCI Express Endpoint Controller and SMSC's PCI Express PHY Successfully Pass PCI-SIG Compliance
  • Falanx Microsystems Demonstrates First H.264 Hardware Implementation for Mobile Devices at 3GSM
  • Imagination Technologies debuts accelerated OpenVG technology on the PowerVR MBX Family at 3GSM 2006
  • NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric and Sharp to Jointly Develop Platform for W-CDMA Handsets
  • StarCore and Hantro announce immediate availability of high performance H.264 video decoder
  • Spreadtrum Utilizes CEVA-X DSP to Develop TD-SCDMA Baseband Processors for 3G Wireless Handsets
  • CEVA Low Power DSP Core Enables EoNex Modem Chip, Korea's First for CDMA2000 1x Wireless Phones
  • VMTS and CEVA Partner for Development of Next-Generation Mobile Solutions
  • SRS WOW XT and SRS XSPACE 3D Now Available on Tensilica's Xtensa HiFi 2 Audio Engine for Mobile Phones
  • Epson Renews Contract for Tensilica's Xtensa Configurable Processors
  • LTRIM's System Supervisor IP Blocks Accurately Sense Temperature at Low Power
  • Silembia unveils it DVB-H Silicon IP at 3GSM World Congress 2006 in Barcelona, 13th to 16th February
  • Iwedia & Silembia to unveil a DVB-H client-side solution, hardware & software, at 3GSM World Congress in Barcelona, 13th to 16th of February
  • Spreadtrum License Hantro Video Solution for their Baseband IC Product Family
  • Saifun Extends its Licensing Agreement with Japanese Licensee
  • Silistix Joins OCP-IP
  • Xilinx & Sensory Networks Announce Industry's Most Scalable, FPGA-Enabled Network Security Acceleration Solution For Emerging UTM Security Appliances
  • Xilinx Authorizes Stock Repurchase Program
  •    Headlines for Feb. 11, 2006
  • TIVR and Streamezzo bring ready-to-deploy optimized embedded Mobile TV solutions
  •    Headlines for Feb. 10, 2006
  • Zoran Settles Litigation With Mediatek and UMC
  • ESL needs more work, panelists say
  • TSMC January 2006 Sales Report
  • Patriot Scientific Corporation Announces Debenture Conversion, Warrant Buyback Agreements
  •    Headlines for Feb. 09, 2006
  • Transmeta and Culturecom Mutually Terminate Contingent Processor Technology License and Sale Agreement for the Chinese Market
  • Nokia Growth Partners invests four million euros in Bitboys to support the company's growth and product development
  • CEVA to Showcase Continued Leadership in IP for Wireless Handset Applications at 3GSM World Congress 2006
  • Tensilica Establishes India Subsidiary for Innovative Research and Development
  •    Headlines for Feb. 08, 2006
  • Faraday Introduced a New MP3 Player SoC - FIE7010 HD-based Audio Platform Solution
  • ARM and Handshake Solutions Announce Availability of Industry's First Clockless Processor for Real-Time Chip Designs
  • Centrality Communications licenses Imagination Technologies' PowerVR MBX
  • LSI Logic First to Integrate Dual XFI SerDes Into 10G Ethernet SoC Design
  • HiTech Announces the Worldwide Availability of PLDA's Altera Stratix-II based PCI-X evaluation boards
  • Lattice Semiconductor Launches LatticeSC System Chip FPGA Family
  • Saifun to offer more shares in May, says report
  • Ultra Electronics Chooses Altera's Stratix II Devices to Cut IP Security Costs and Seek New SDR Markets
  • IP protection based on trust, technology
  •    Headlines for Feb. 07, 2006
  • Rambus Announces Resignation of Chief Financial Officer
  • Enhanced RapidWorx(TM) Design Kit From LSI Logic Accelerates Time to Revenue for SoC Designs
  • ESS Technology Licenses Kilopass XPM Memory Technology
  • Impinj and Convergence Systems Limited Announce OEM Licensing Agreement for RFID Readers
  • Enigma Semiconductor Licenses Rambus' Advanced Backplane Technology
  • Renesas Technology to License 1Gbit AG-AND Technology to PSC
  • Denali Appoints Raju Pudota as Managing Director of India Subsidiary
  • Xilinx Ships FPGA Industry's Only Compliant Programmable x8 PCI Express IP Core
  • ARM faces automotive shut out from Freescale, ST
  • STMicroelectronics and Freescale Launch Broad Technology Agreement for Automotive Applications
  • How to take advantage of partial reconfiguration in FPGA designs
  • Xelic Announces Family of SONET/SDH Transport Processor Cores for Integration into FPGA or ASIC Networking Applications
  • Altera and TelASIC Announce Breakthrough Power Efficiency for 3G/3.5G Wireless Base Station Radios
  • iRoC Launches Its Professional Service for Soft Error Risk-Free Designs
  • Falanx Microsystems Demonstrates Desktop Graphics Programmability on Mobile Platforms at 3GSM
  • Hot Embedded DSP Market Almost Twice the General-Purpose DSP Market, According to New Forward Concepts Study
  • Sonics Expands Asia Operations to Support Regional Business Growth
  •    Headlines for Feb. 06, 2006
  • Synopsys' New Designware USB 2.0 nanoPHY IP to Cut Power and Size in Half
  • Rambus Introduces New Innovative Decision Feedback Equalization Technology
  • New Multi-threading Solution From MIPS Technologies Delivers Significant Gains in System Performance for the Embedded Market
  • CoWare Adds MIPS32 34K (TM) Processor Support Package to SystemC-based Model Library
  • Lightspeed Launches Reconfigurable IP Technology Offering
  • TTPCom announces blueprint for $20 ULC cellular handset
  • Mobileye Licenses MIPS Technologies' Multi-threading MIPS32 34Kf Core for Next-Generation Driver Assistance SoC
  • u-Nav Microelectronics Picks Tensilica's Xtensa Processors for Portable GPS Systems
  • Xilinx Announces PlanAhead 8.1, Delivering a Two Speed-Grade Advantage Over Competing Solutions
  • Jeffrey Bouchard Joins Open-Silicon Executive Team
  • China patents a must-have -- Foreigners, locals cope with country's spotty IP rights record
  • Oki Semiconductor and IAR Systems Announce Availability of New IAR Embedded Workbench Tools for Oki’s ARM9-based Advantage Microcontrollers
  • Altera's Stratix II FPGAs Enable 667-Mbps DDR2 SDRAM Data Rate
  • SMIC reports 2005 fourth quarter results
  • Hantro to demonstrate the latest in mobile video technologies at 3GSM World Congress
  •    Headlines for Feb. 03, 2006
  • ZiLOG(R) Unveils 32-Bit ARM-9(R) Application-Specific Strategy to Focus on Security and Point-of-Sale Markets
  • CAST Rolls Ten Years of 8051 Experience into Configurable Processor Core
  •    Headlines for Feb. 02, 2006
  • SafeNet Reports Fourth Quarter and 2005 Financial Results
  • ATEME announces a 4 million Euro investment by XAnge Private Equity and Ventech
  • SIDSA launches a state-of-the-art DVB-H demodulator chip
  • Imagination Technologies unveils first official certified benchmark numbers for Futuremark 3DMark Mobile06 running on Texas Instruments OMAP2420 processor incorporating PowerVR MBX
  • Growth of Integrated Circuits in 2005 Was 7.8%, 2006 Expected to Be in Double-Digits
  • Startup prepares UWB competitor for market
  •    Headlines for Feb. 01, 2006
  • Semico Research Predicts ''Age of Configurability''; Configurable Cores to Outpace Growth of Fixed Architecture CPUs by 5 to 1
  • MoSys Inc. Announces Licensing Agreement with YAMAHA Corporation
  • NEC Electronics, Sony, and Toshiba Announce Joint Development of 45-nanometer System LSI Process Technologies
  • Wi-LAN Announces Exit of Equipment Business to Concentrate on Core Broadband Wireless Intellectual Property Business
  • Tower Semiconductor Reports Positive EBITDA and 51% Quarter Over Quarter Revenue Growth for Q4 2005
  • Bluespec Momentum Grows as Leading Mobile Semiconductor Firms Adopt Its ESL Synthesis
  • Startups say ESL adoption accelerating
  • OCP-IP Hosts 2nd Annual OCP-IP Pavilion at DATE; Conference Within a Conference Discusses Trends and Insight Surrounding IP Reuse

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