MoSys and CEVA Partner to Deliver Integrated SATA 3.0 PHY and Controller IP Solution
SUNNYVALE, Calif. & SAN JOSE, Calif., Jun 09, 2010 -- MoSys, Inc., a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), and CEVA, Inc., the leading licensor of silicon intellectual property (SIP) DSP cores, multimedia and storage platform solutions, have partnered to deliver a joint PHY plus Controller solution for SATA 3.0, for both Host and Device side applications.
The combined solution unleashes the full potential of embedding 6Gbps SATA interfaces in next generation products by leveraging MoSys' 6Gbps SerDes PHY and CEVA's SATA 3.0 Controller IP. By co-operating to provide proven interoperability and direct engineering assistance, MoSys and CEVA will help SATA designers speed time-to-market, as well as reduce costs and risks when integrating SATA 3.0. In addition to strong technical collaboration, MoSys and CEVA will also partner to jointly market their new, integrated SATA 3.0 PHY and Controller IP solution.
"CEVA has an influential history in Serial ATA. Their recently announced SATA 3.0 solution is the perfect complement to our SerDes PHY. By combining our technical expertise, we have created a state of the art solution that should come up smoothly and faultlessly for our shared customers," said David DeMaria, Vice President of Business Operations at MoSys. "We are delighted to be working with CEVA."
"Our latest generation SATA 3.0 Controller IP builds on the highly popular CPU off-loading features of the CEVA-SATA 2.6 Controller to provide enhanced NCQ for isochronous data transfers and queue management," said Aviv Malinovitch, Vice President, Operations at CEVA. "We are very pleased to expand the eco-system and choices for customers by partnering with MoSys, and we look forward to a long-term partnership."
Information and further details about the integrated SATA 3.0 solution are available from both companies. Contact MoSys at www.mosys.com/contact.php and CEVA at info@ceva-dsp.com.
About MoSys, Inc.
MoSys, Inc. develops serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs. MoSys' IP portfolio includes DDR3 PHYs and SerDes IP that support data rates from 1 - 11 Gigabits per second (Gbps) across a variety of standards. In addition, MoSys offers its flagship, patented 1T-SRAM(R) and 1T-Flash(R) memory cores, which offer a combination of high-density, low power consumption, high speed and low cost advantages for high-performance networking, computing, storage and consumer/graphics applications. MoSys IP is production-proven in more than 225 million devices. MoSys is headquartered in Sunnyvale, California. More information is available on MoSys' website at www.mosys.com.
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
|
Related News
- Gennum's Snowbush IP Group Receives SATA-IO Certification Revision 3.0 at 6Gb/s
- MoSys and PLDA Partner to Deliver Complete PCI Express 2.0 and 3.0 IP Solutions
- Gennum's Snowbush IP Group Delivers Industry's First Available USB 3.0 Integrated PHY and Controller IP
- Faraday Technology and Fresco Logic Partner to Validate SuperSpeed USB PHY (USB 3.0) with SuperSpeed Digital xHCI Host and Device Controller
- USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP in 12nm, 16nm and 22nm process nodes with simple integration and flexible customization is ready for immediate licencing for your advanced SoC design
Breaking News
- Arm revenues up 47%; shares fall
- Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
- X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
- Softbank reported to be in talks to buy Graphcore
- VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
Most Popular
- Synopsys Enters Definitive Agreement to Sell its Software Integrity Business to Clearlake Capital and Francisco Partners
- Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
- Announcing Availability of Silicon-Proven 12bit 1Msps SAR ADC IP Core for Whitebox Licensing with Royalty Free
E-mail This Article | Printer-Friendly Page |