8Kx8 Bits OTP (One-Time Programmable) IP, VIS 0.15µm 1.8V/5V BCD GIII
Carmel Vernia to Step Down as Chairman and CEO of Tower Semiconductor Board Carmel Vernia to Step Down as Chairman and CEO of Tower Semiconductor Board
Mr. Vernia agreed to stay in his current positions while the board appoints his replacements to ensure a smooth transition. Mr. Vernia will continue to serve on the board of directors of Tower after stepping down as chairman and CEO.
About Tower Semiconductor Ltd.
Tower Semiconductor LTD. is a pure-play independent wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.13 micron; it also provides complementary technical services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35 micron and can produce up to 16,000 150mm wafers per month. Fab 2 features 0.18 micron and below process technologies, including foundry-standard technology. When fully equipped, Fab 2 is expected to offer full production capacity of 33,000 200mm wafers per month. Tower's Web site is located at www.towersemi.com.
|
Related News
- Tower Semiconductor Announces the Nomination of Amir Elstein as its New Chairman of the Board
- Credo Appoints Lip-Bu Tan as Chairman and Bolsters Board with the Addition of Industry Veterans Sylvia Acevedo and Manpreet Khaira
- TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
- TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman
- GLOBALFOUNDRIES CEO Ajit Manocha Elected Chairman of Semiconductor Industry Association
Breaking News
- Digital Core Design in cooperation with DCD-SEMI Unveils DCAN-XL: Revolutionary CAN XL IP Core Bridging the Gap Between CAN FD and Ethernet
- Andes, HiRain, and HPMicro Join Hands to Build RISC-V AUTOSAR Software Ecosystem
- Kevin O'Buckley to Lead Foundry Services at Intel
- M31 Q1 Revenue Increases 9.3% YoY, Advanced Processes Drive QoQ Growth
- ADTechnology and ANAFLASH to Team Up for Embedded Vision Summit (EVS) showcase
Most Popular
- Is Graphcore Deal Finally About to Close?
- Mobiveil and InPsytech Announce Successful Inter-Op Verification of Enterprise Flash Controller Design IP and ONFI 5.1 PHY IP
- Frontgrade Gaisler Leads the Way in RISC-V Processor Development for Space Applications
- Arm revenues up 47%; shares fall
- lowRISC Deploys Real Intent Ascent Lint, Meridian CDC, & Meridian RDC for OpenTitan Project
E-mail This Article | Printer-Friendly Page |